Package-warpage measurement data and workstation software

Applicable purchasers

Semiconductor equipment, fixtures, laboratories and packaging supporting companies

Test and assembly objects

Customer-supplied displacement optical measurement links and packages

Development and delivery

Bind scanning coordinates, reference surface, temperature and sample, and output warpage data processing records

Project input

Position angle reference, coordinate definition, installation posture and repeated measurement conditions

Acceptance method

Fix the reference surface, temperature, scan coordinates and sample attitude, and check warpage data, unit and repeat positioning differences against independent references or known topography.

Implementation steps

Object and interface verification → Reference link and solution confirmation → Single module prototype → Instrument and equipment joint debugging → Independent reference re-inspection → Source code, configuration and record delivery.

Equipment condition and scope confirmation

The scope may include control boards, firmware, instrument drivers, host software, process configuration and test records. Mechanical fixtures, pressure-bearing structures, fluid circuits, power circuits and optical or acoustic references are provided or separately designed by the responsible parties. Measurement specifications are established through validation with the target equipment and independent references.

Source code, design documents, instrument licensing, procurement, on-site support and ongoing maintenance scope are listed in the project documents.

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