Wafer-prober and instrument coordination software

Applicable purchasers

Semiconductor equipment, fixtures, laboratories and packaging supporting companies

Test and assembly objects

Customer-supplied probe stations, measuring instruments and wafer maps

Development and delivery

Linked coordinates, needle drop status and instrument testing, output wafer result mapping

Project input

Existing institutions and instruments, sample identities, queues/interlocks, and failure fallback rules

Acceptance method

Fixed wafer map, probe station coordinates and instrument configuration, verify movement/pin drop permission, test triggering, position to result mapping and failure fallback.

Implementation steps

Object and interface verification → Reference link and solution confirmation → Single module prototype → Instrument and equipment joint debugging → Independent reference re-inspection → Source code, configuration and record delivery.

Equipment condition and scope confirmation

The scope may include control boards, firmware, instrument drivers, host software, process configuration and test records. Mechanical fixtures, pressure-bearing structures, fluid circuits, power circuits and optical or acoustic references are provided or separately designed by the responsible parties. Measurement specifications are established through validation with the target equipment and independent references.

Source code, design documents, instrument licensing, procurement, on-site support and ongoing maintenance scope are listed in the project documents.

Related services

• View the Test Assembly and Instrumentation Development Catalog
• Fiber-coupling active-alignment station software